发明授权
- 专利标题： Method of fabricating organic electroluminescence panel package
- 专利标题（中）： 制造有机电致发光面板封装的方法
-
申请号： US10612608申请日： 2003-07-01
-
公开(公告)号： US07011987B2公开(公告)日： 2006-03-14
- 发明人: Chin-Long Wu
- 申请人： Chin-Long Wu
- 申请人地址： TW Hsinchu
- 专利权人： RiTdisplay Corporation
- 当前专利权人： RiTdisplay Corporation
- 当前专利权人地址： TW Hsinchu
- 代理机构： J.C. Patents
- 主分类号： H01L21/44
- IPC分类号： H01L21/44
摘要：
A packaging fabrication for an organic electroluminescence panel is disclosed. The panel comprises a printed circuit board, one or a plurality of OEL panels and a plurality of bumps, wherein the OEL is provided with poly solder interconnections in area array. The printed circuit board is provided with a plurality of solder pads arranged with bumps. One or a plurality of OEL is arranged on the printed circuit board and the poly solder interconnections and bumps are used to electrically connect the OEL with the printed circuit board. Further, the excellent heat dissipation property of the low re-flow temperature of the poly solder interconnections and the ceramic printed circuit board provides packaging fabrication for low temperature low stress OEL.
公开/授权文献
信息查询
IPC分类:
