发明授权
- 专利标题： Lead free bump and method of forming the same
- 专利标题（中）： 无铅焊点及其形成方法
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申请号： US10743757申请日： 2003-12-24
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公开(公告)号： US07012333B2公开(公告)日： 2006-03-14
- 发明人: Masashi Shimoyama , Hiroshi Yokota , Rei Kiumi , Fumio Kuriyama , Nobutoshi Saito
- 申请人： Masashi Shimoyama , Hiroshi Yokota , Rei Kiumi , Fumio Kuriyama , Nobutoshi Saito
- 申请人地址： JP Tokyo
- 专利权人： Ebara Corporation
- 当前专利权人： Ebara Corporation
- 当前专利权人地址： JP Tokyo
- 代理机构： Wenderoth, Lind & Ponack, L.L.P.
- 优先权： JP2002-378010 20021226
- 主分类号： H01L29/40
- IPC分类号： H01L29/40
摘要：
The present invention relates to a lead-free bump with suppressed formation of voids, obtained by reflowing a plated film of Sn—Ag solder alloy having an adjusted Ag content, and a method of forming the lead-free bump. The lead-free bump of the present invention is obtained by forming an Sn—Ag alloy film having a lower Ag content than that of an Sn—Ag eutectic composition by plating and reflowing the plated alloy film.
公开/授权文献
- US20040219775A1 Lead free bump and method of forming the same 公开/授权日：2004-11-04