发明授权
- 专利标题： Interconnect structure and method for connecting buried signal lines to electrical devices
- 专利标题（中）： 将埋地信号线连接到电气设备的互连结构和方法
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申请号： US10787647申请日： 2004-02-25
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公开(公告)号： US07018219B2公开(公告)日： 2006-03-28
- 发明人: Steven A. Rosenau
- 申请人： Steven A. Rosenau
- 主分类号： H01R12/00
- IPC分类号： H01R12/00
摘要：
An electrical component, such as a trace, signal line, or contact pad connected to the trace or signal line, is covered by one or more layers. The electrical component is connected directly to an electrical device by forming an opening through the one or more layers. The opening exposes a portion of the electrical component. A connector, such as a solder ball, a pin contact, or a wire bond, is then attached to the exposed portion of the electrical component. The connector connects directly to another electrical device to create an electrical connection between the electrical component and the electrical device. The electrical device may be configured, for example, as a second signal line or contact pad in another stripline circuit, a microstrip circuit, an integrated circuit, or an electrical component.
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