Invention Grant
- Patent Title: Curable composition
- Patent Title (中): 可固化组合物
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Application No.: US10828180Application Date: 2004-04-21
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Publication No.: US07019074B2Publication Date: 2006-03-28
- Inventor: Seigo Nakamura , Takashi Hasegawa
- Applicant: Seigo Nakamura , Takashi Hasegawa
- Applicant Address: JP Osaka US TX Pasadena
- Assignee: Kaneka Corporation,Kaneka Texas Corporaiton
- Current Assignee: Kaneka Corporation,Kaneka Texas Corporaiton
- Current Assignee Address: JP Osaka US TX Pasadena
- Agency: Kenyon & Kenyon LLP
- Main IPC: C08L51/00
- IPC: C08L51/00 ; C08L53/02

Abstract:
A curable composition comprising (A) an organic polymer having a reactive silicon-containing group, and (B) a block copolymer containing in its molecule one soft segment and at least one hard segment having structural units of an aromatic vinyl monomer. The composition has an improved adhesive property to substrates to which conventional curable compositions comprising an organic polymer having a reactive silicon-containing group are hard to adhere, such as mortar, concrete, fluorocarbon resin coats, EPDM rubber sheet, polyvinyl chloride resin sheet and acrylic resin substrate.
Public/Granted literature
- US20040214950A1 Curable composition Public/Granted day:2004-10-28
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