Invention Grant
- Patent Title: High density magnetoresistance memory and manufacturing method thereof
- Patent Title (中): 高密度磁阻记忆及其制造方法
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Application No.: US10714609Application Date: 2003-11-18
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Publication No.: US07020011B2Publication Date: 2006-03-28
- Inventor: Eun-sik Kim , Yong-su Kim
- Applicant: Eun-sik Kim , Yong-su Kim
- Applicant Address: KR Suwon
- Assignee: Samsung Electronics Co., Ltd.
- Current Assignee: Samsung Electronics Co., Ltd.
- Current Assignee Address: KR Suwon
- Agency: Buchanan Ingersol PC
- Priority: KR10-2003-0035302 20030602
- Main IPC: G11C11/00
- IPC: G11C11/00

Abstract:
A high density magnetoresistance memory and a manufacturing method thereof are provided. The magnetoresistance memory includes: a memory cell storing information; a conductive line contacting the memory cell to change the magnetization direction of the memory cell by generating a magnetic field; and at least one flux concentrating island (FCI) located between the conductive line and the memory cell for concentrating flux onto the memory cell. The flux is concentrated onto the memory cell to reduce a required electric current and improve selectivity, thereby forming a high-density and highly integrated memory cell.
Public/Granted literature
- US20040240267A1 High density magnetoresistance memory and manufacturing method thereof Public/Granted day:2004-12-02
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