发明授权
- 专利标题： Method of polishing a substrate with a polishing system containing conducting polymer
- 专利标题（中）： 用含有导电聚合物的抛光系统抛光基材的方法
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申请号： US10198841申请日： 2002-07-19
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公开(公告)号： US07021993B2公开(公告)日： 2006-04-04
- 发明人: Jian Zhang , Fred Sun , Shumin Wang , Isaac K. Cherian , Eric H. Klingenberg
- 申请人： Jian Zhang , Fred Sun , Shumin Wang , Isaac K. Cherian , Eric H. Klingenberg
- 申请人地址： US IL Aurora
- 专利权人： Cabot Microelectronics Corporation
- 当前专利权人： Cabot Microelectronics Corporation
- 当前专利权人地址： US IL Aurora
- 主分类号： B24B1/00
- IPC分类号： B24B1/00
摘要：
The invention provides a method of polishing a substrate comprising (i) contacting a substrate with a polishing system comprising (a) an abrasive, a polishing pad, a means for oxidizing a substrate, or any combination thereof, (b) a conducting polymer having an electrical conductivity of about 10−10 S/cm to about 106 S/cm, and (c) a liquid carrier, and (ii) abrading or removing at least a portion of the substrate to polish the substrate.
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