发明授权
- 专利标题： Method for fabricating circuit module
- 专利标题（中）： 制造电路模块的方法
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申请号： US10705823申请日： 2003-11-13
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公开(公告)号： US07022554B2公开(公告)日： 2006-04-04
- 发明人: Kazuo Kasue , Takehisa Kajikawa , Satoru Hachinohe
- 申请人： Kazuo Kasue , Takehisa Kajikawa , Satoru Hachinohe
- 申请人地址： JP Kyoto
- 专利权人： Murata Manufacturing Co., Ltd.
- 当前专利权人： Murata Manufacturing Co., Ltd.
- 当前专利权人地址： JP Kyoto
- 代理机构： Keating & Bennett, LLP
- 优先权： JP2002-330686 20021114; JP2003-326638 20030918
- 主分类号： H01L21/44
- IPC分类号： H01L21/44 ; H01L21/48 ; H01L21/50
摘要：
A method for fabricating a circuit module includes a step of filling the gap between a chip component and a substrate on which the chip component is mounted in a flip chip configuration with resin. The method uses simplified equipment and minimizes the undesired spread of resin. The resin is supplied between the sidewall of a dispenser needle and the sidewall of the chip component. Due to capillary action, a resin pool is formed and then the gap between the chip component and the substrate is spontaneously filled with the resin of the resin pool.
公开/授权文献
- US20040097095A1 Method for fabricating circuit module 公开/授权日：2004-05-20
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