发明授权
US07022592B2 Ammonia-treated polysilicon semiconductor device 失效
氨处理多晶硅半导体器件

Ammonia-treated polysilicon semiconductor device
摘要:
Semiconductor devices, and methods of fabricating, having ammonia-treated polysilicon devices are provided. A substrate is provided upon which a polysilicon layer is formed. The polysilicon layer is treated with ammonia. Thereafter, portions of the polysilicon layer may be oxidized, forming poly-oxide regions. The poly-oxide regions may be used, for example, to form the poly-oxide layer of a split-gate transistor. The ammonia treatment reduces the tendency of the polysilicon to oxidize along the grain boundaries, thereby allowing smaller designs to be fabricated without bridging occurring between polysilicon structures.
公开/授权文献
信息查询
0/0