发明授权
- 专利标题: Ammonia-treated polysilicon semiconductor device
- 专利标题(中): 氨处理多晶硅半导体器件
-
申请号: US10678783申请日: 2003-10-03
-
公开(公告)号: US07022592B2公开(公告)日: 2006-04-04
- 发明人: Wen-Ting Chu , Yeur-Luen Tu
- 申请人: Wen-Ting Chu , Yeur-Luen Tu
- 申请人地址: TW Hsin-Chu
- 专利权人: Taiwan Semiconductor Manufacturing Company, Ltd.
- 当前专利权人: Taiwan Semiconductor Manufacturing Company, Ltd.
- 当前专利权人地址: TW Hsin-Chu
- 代理机构: Slater & Matsil, L.L.P.
- 主分类号: H01L27/108
- IPC分类号: H01L27/108
摘要:
Semiconductor devices, and methods of fabricating, having ammonia-treated polysilicon devices are provided. A substrate is provided upon which a polysilicon layer is formed. The polysilicon layer is treated with ammonia. Thereafter, portions of the polysilicon layer may be oxidized, forming poly-oxide regions. The poly-oxide regions may be used, for example, to form the poly-oxide layer of a split-gate transistor. The ammonia treatment reduces the tendency of the polysilicon to oxidize along the grain boundaries, thereby allowing smaller designs to be fabricated without bridging occurring between polysilicon structures.
公开/授权文献
- US20050073015A1 Ammonia-treated polysilicon semiconductor device 公开/授权日:2005-04-07
信息查询
IPC分类: