Invention Grant
- Patent Title: Sockets for microassembly
- Patent Title (中): 微组装插座
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Application No.: US11074448Application Date: 2005-03-08
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Publication No.: US07025619B2Publication Date: 2006-04-11
- Inventor: Kenneth Tsui , Aaron Geisberger
- Applicant: Kenneth Tsui , Aaron Geisberger
- Applicant Address: US TX Richardson
- Assignee: ZYVEX Corporation
- Current Assignee: ZYVEX Corporation
- Current Assignee Address: US TX Richardson
- Agency: Haynes and Boone, LLP
- Main IPC: H01R13/627
- IPC: H01R13/627
Abstract:
An apparatus including at least three deflectable members each configured to deflect during assembly with a component, and also configured to remain in contact with the component after assembly with the component. At least one of the deflectable members and the component has a thickness not greater than about 1000 microns.
Public/Granted literature
- US20050181636A1 Sockets for microassembly Public/Granted day:2005-08-18
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