发明授权
- 专利标题： Method of manufacturing circuit device
- 专利标题（中）： 制造电路装置的方法
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申请号： US10211758申请日： 2002-08-02
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公开(公告)号： US07026190B2公开(公告)日： 2006-04-11
- 发明人: Yoshiyuki Kobayashi , Noriaki Sakamoto , Kouji Seki , Kouji Takahashi
- 申请人： Yoshiyuki Kobayashi , Noriaki Sakamoto , Kouji Seki , Kouji Takahashi
- 申请人地址： JP Osaka
- 专利权人： Sanyo Electric Co., Ltd.
- 当前专利权人： Sanyo Electric Co., Ltd.
- 当前专利权人地址： JP Osaka
- 代理机构： Fish & Richardson P.C.
- 优先权： JPP.2001-255474 20010827
- 主分类号： H01L21/44
- IPC分类号： H01L21/44 ; H01L21/48 ; H01L21/50
摘要：
Wire bonding is performed efficiently by pressing circumference end of a block of a conductive foil by a clamper, and by performing wire bonding of a circuit element of a mounting portion in the block and the conductive pattern in a lump. At a time of wire bonding, oxidation of the conductive foil is prevented by blowing nitrogen gas to the conductive foil from paths and provided at the clamper.
公开/授权文献
- US20030040138A1 Method of manufacturing circuit device 公开/授权日：2003-02-27
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