发明授权
US07026869B2 Broadband amplifier having offset microstrip section in a housing module
失效
宽带放大器在外壳模块中具有偏移微带部分
- 专利标题: Broadband amplifier having offset microstrip section in a housing module
- 专利标题(中): 宽带放大器在外壳模块中具有偏移微带部分
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申请号: US10338325申请日: 2003-01-08
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公开(公告)号: US07026869B2公开(公告)日: 2006-04-11
- 发明人: Joseph L. Merenda , Michael Zaffarano , Eric Darvin
- 申请人: Joseph L. Merenda , Michael Zaffarano , Eric Darvin
- 申请人地址: US NY Hauppauge
- 专利权人: L-3 Communications
- 当前专利权人: L-3 Communications
- 当前专利权人地址: US NY Hauppauge
- 代理机构: Baker Botts L.L.P.
- 主分类号: H03F3/195
- IPC分类号: H03F3/195
摘要:
A broadband driver amplifier module is made using an arrangement of MMICS and microstrip to provide inline rf connectors for the input and output and a small package size. The input and output microstrips incorporate a microstrip portion which is at an angle to the axis of the input connector providing an offset from the axis of the input connector. There is provided at least one MMIC extending from the input microstrip at the offset across the input connector axis and having an output on the other side of the axis. This arrangement provides for an overall zigzag configuration which reduces the axial length of the package while maintaining inline input and output connectors. The invention further includes novel arrangements for MMIC mounting and d.c. blocks used in the amplifier.
公开/授权文献
- US20040130417A1 Broadband amplifier 公开/授权日:2004-07-08
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