Invention Grant
- Patent Title: Method and apparatus for transferring a thin plate
- Patent Title (中): 传递薄板的方法和装置
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Application No.: US10384791Application Date: 2003-03-11
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Publication No.: US07029224B2Publication Date: 2006-04-18
- Inventor: Keishi Kubo , Keiichi Yoshizumi , Hiroyuki Takeuchi , Koji Handa , Takaaki Kassai
- Applicant: Keishi Kubo , Keiichi Yoshizumi , Hiroyuki Takeuchi , Koji Handa , Takaaki Kassai
- Applicant Address: JP Osaka
- Assignee: Matsushita Electric Industrial Co., Ltd.
- Current Assignee: Matsushita Electric Industrial Co., Ltd.
- Current Assignee Address: JP Osaka
- Agency: Greenblum & Bernstein, P.L.C.
- Priority: JP2002-067407 20020312
- Main IPC: B25J17/02
- IPC: B25J17/02

Abstract:
A method for transferring a thin plate is provided, in which three or more grasping claws of a transfer arm grasp the periphery of the thin plate in order to transfer it to a predetermined transfer position, and three or more holding claws hold the periphery of the thin plate in the transfer position. The transfer arm rotates about a shaft which is in a direction of a vector sum of a first vector perpendicular to a surface of the thin plate before transfer, and a second vector perpendicular to the surface of the thin plate after the transfer, to transfer the thin plate with changing the posture thereof.
Public/Granted literature
- US20040037690A1 Method and apparatus for transferring a thin plate Public/Granted day:2004-02-26
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