Invention Grant
- Patent Title: Bending press system
- Patent Title (中): 弯曲印刷机系统
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Application No.: US10760418Application Date: 2004-01-21
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Publication No.: US07029429B2Publication Date: 2006-04-18
- Inventor: Ichio Akami , Takahiro Ogawa , Masaaki Sato , Goujyu Umemoto , Toshiyuki Kondo
- Applicant: Ichio Akami , Takahiro Ogawa , Masaaki Sato , Goujyu Umemoto , Toshiyuki Kondo
- Applicant Address: JP
- Assignee: Amada Company, Limited
- Current Assignee: Amada Company, Limited
- Current Assignee Address: JP
- Agency: Blank Rome LLP
- Priority: JPP11-6914 19990113
- Main IPC: B23Q3/155
- IPC: B23Q3/155

Abstract:
A bending press system provided with a bending press with at least one bending station to mount a plurality of divided tools and, tool housing devices to house divided metals to be used on the bending press and, tool exchange devices which mount the divided tools on the bending station. The system is provided with a first memory which stores housed positions of each divided tool housed in the housing devices and a second memory which stores the bending line length of the bent part, the flange length and the bending angle of the bent product and, a first computation element which, based on the bending line length, flange length, bending angle, computes the tool (cross section shape) type and the length of the bending station, and a second computation element which, based on the tool type and length of the bending station computes the arrangement of each divided tool on the bending station, and an NC control device which controls the tool exchange device so that each divided tool is moved from the housed position in the housing device to a determined arrangement position.
Public/Granted literature
- US20040157715A1 Bending press system Public/Granted day:2004-08-12
Information query
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