The heat-dissipating module includes at least one heat-dissipating device and a terminal mounted and fixed on one side of the heat-dissipating device and electrically connected with the heat-dissipating device. As the heat-dissipating module is inserted into a frame of the system, the terminal will be received by a receptacle inside the system such that the heat-dissipating module can be electrically connected to the system. The heat-dissipating module can be easily dissembled and replaced in a system without turning off the system and can provide the best heat-dissipating efficiency in a limited space of the system without being affected by the inside height or thickness of the system.