- 专利标题： Apparatus for electrochemically depositing a material onto a workpiece surface
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申请号： US10305860申请日： 2002-11-27
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公开(公告)号： US07033464B2公开(公告)日： 2006-04-25
- 发明人: Ismail Emesh , Saket Chadda
- 申请人： Ismail Emesh , Saket Chadda
- 申请人地址： US AZ Chandler
- 专利权人： SpeedFam-IPEC Corporation
- 当前专利权人： SpeedFam-IPEC Corporation
- 当前专利权人地址： US AZ Chandler
- 代理机构： Snell & Wilmer L.L.P.
- 主分类号： C25D17/00
- IPC分类号： C25D17/00
摘要：
A multi-process workpiece apparatus is disclosed. The multi-process workpiece apparatus includes an electrochemical deposition apparatus which has a wafer contacting surface having at least one electrical conductor disposed therein. The multi-process workpiece apparatus also includes a planarization apparatus and at least one workpiece handling robot configured to transport a workpiece from the electrochemical deposition apparatus to the planarization apparatus.