Invention Grant
- Patent Title: Crimp state estimation apparatus for crimp contact terminal and quality determination apparatus for crimp contact terminal
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Application No.: US10776599Application Date: 2004-02-12
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Publication No.: US07036226B2Publication Date: 2006-05-02
- Inventor: Megumi Saito , Naoki Ito
- Applicant: Megumi Saito , Naoki Ito
- Applicant Address: JP Tokyo
- Assignee: Yazaki Corporation
- Current Assignee: Yazaki Corporation
- Current Assignee Address: JP Tokyo
- Agency: Sughrue Mion, PLLC
- Priority: JPP2003-035754 20030213
- Main IPC: H01R43/04
- IPC: H01R43/04

Abstract:
A crimp state estimation apparatus includes: an information input section for inputting information on an crimp contact terminal, an electric wire, an anvil, and the crimper and an input compression ratio of a core wire of the electric wire; and an estimation unit for calculating a total length of the bottom wall and the pair of crimp pieces after crimp in a cross section orthogonal to the core wire based on the information and the input compression ratio and estimating a cross-sectional shape of the bottom wall and the pair of crimp pieces after crimp based on the total length.
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