发明授权
- 专利标题： Manufacturing method of circuit substrate, circuit substrate and manufacturing device of circuit substrate
- 专利标题（中）： 电路基板，电路基板及电路基板制造装置的制造方法
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申请号： US10668777申请日： 2003-09-22
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公开(公告)号： US07037812B2公开(公告)日： 2006-05-02
- 发明人: Yuusuke Kawahara , Tetsuya Yoshida , Kazuhiro Murata , Hiroshi Yokoyama
- 申请人： Yuusuke Kawahara , Tetsuya Yoshida , Kazuhiro Murata , Hiroshi Yokoyama
- 申请人地址： JP Tokyo JP Tokyo
- 专利权人： Konica Minolta Holdings, Inc.,National Institute of Advanced Industrial Science and Technology
- 当前专利权人： Konica Minolta Holdings, Inc.,National Institute of Advanced Industrial Science and Technology
- 当前专利权人地址： JP Tokyo JP Tokyo
- 代理机构： Cohen, Pontani, Lieberman & Pavane
- 优先权： JP2002-278223 20020924; JP2003-290162 20030808
- 主分类号： H01L21/20
- IPC分类号： H01L21/20
摘要：
A manufacturing method of a circuit substrate, in which an electronic circuit is formed on a surface of a base member by a solution jetting device. The manufacturing method comprises: jetting liquid drops of a solution which is supplied into a nozzle having a discharge port with an inner diameter of 0.1 μm to 100 μm and includes a plurality of fine particles to form an electronic circuit by melting and sticking to one another and a dispersant for dispersing the fine particles, from the discharge port toward the surface of the base member by applying a voltage of an arbitrary waveform to the solution to charge the solution; and exposing the jetted liquid drops received on the surface of the base member to light or heat to make the fine particles melt and stick to one another.
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