Invention Grant
- Patent Title: Method and apparatus for dissolving a gas into a liquid for single wet wafer processing
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Application No.: US10637725Application Date: 2003-08-07
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Publication No.: US07037842B2Publication Date: 2006-05-02
- Inventor: Steven Verhaverbeke , J. Kelly Truman
- Applicant: Steven Verhaverbeke , J. Kelly Truman
- Applicant Address: US CA Santa Clara
- Assignee: Applied Materials, Inc.
- Current Assignee: Applied Materials, Inc.
- Current Assignee Address: US CA Santa Clara
- Agency: Blakely Sokoloff Taylor & Zafman
- Main IPC: H01L21/302
- IPC: H01L21/302 ; H01L21/461
Abstract:
A method and apparatus for processing a wafer is described. According to the present invention a wafer is placed on a substrate support. A liquid is then fed through a conduit having an output opening over the wafer. A gas is dissolved in the liquid prior to the liquid reaching the output over the wafer by flowing a gas into the conduit through a venturi opening formed in the conduit. The liquid with dissolved gas is then fed through the opening and onto the wafer where it can be used to etch, clean, or rinse a wafer.
Public/Granted literature
- US20040029388A1 Method and apparatus for dissolving a gas into a liquid for single wet wafer processing Public/Granted day:2004-02-12
Information query
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