发明授权
- 专利标题: Method of fabricating a mandrel for electroformation of an orifice plate
- 专利标题(中): 制造孔板电铸心轴的方法
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申请号: US10692374申请日: 2003-10-22
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公开(公告)号: US07040016B2公开(公告)日: 2006-05-09
- 发明人: Deanna J. Bergstrom , Rio Rivas
- 申请人: Deanna J. Bergstrom , Rio Rivas
- 申请人地址: US TX Houston
- 专利权人: Hewlett-Packard Development Company, L.P.
- 当前专利权人: Hewlett-Packard Development Company, L.P.
- 当前专利权人地址: US TX Houston
- 主分类号: B21D53/76
- IPC分类号: B21D53/76 ; B23P17/00 ; B41J2/14 ; B41J2/16
摘要:
A method of fabricating a mandrel for electroformation of an orifice plate. An array of mask elements may be created adjacent a substrate. Surface regions of the substrate disposed generally between the mask elements may be removed, to create a base having a base surface and a plurality of pillars extending from the base surface according to the array of mask elements. Each pillar may have a perimeter defined by an orthogonal projection of one of the mask elements onto the substrate. An electrical-conduction enhancer may be deposited adjacent the base surface and terminating at least substantially at the perimeter, to create a conductive layer to support growth of the orifice plate.
公开/授权文献
- US20050086805A1 Mandrel for electroformation of an orifice plate 公开/授权日:2005-04-28
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