Invention Grant
- Patent Title: Fabrication of thick film electrical components
- Patent Title (中): 厚膜电气部件的制造
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Application No.: US10639794Application Date: 2003-08-12
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Publication No.: US07042331B2Publication Date: 2006-05-09
- Inventor: Jiming Zhou , Dwadasi H. Sarma , Carl W. Berlin , John D Myers , M. Ray Fairchild
- Applicant: Jiming Zhou , Dwadasi H. Sarma , Carl W. Berlin , John D Myers , M. Ray Fairchild
- Applicant Address: US MI Troy
- Assignee: Delphi Technologies, Inc.
- Current Assignee: Delphi Technologies, Inc.
- Current Assignee Address: US MI Troy
- Agent Scott A. McBain
- Main IPC: H01C1/14
- IPC: H01C1/14

Abstract:
A thick-film resistor component may include a thick film component formed between a thick-film resistor and an electrically conductive sheet, wherein a portion of the sheet is selectively removed to form resistor contacts while exposing a portion of the thick-film component. Electrical terminals to a thick-film resistor may be sized to reduce stress and/or be selectively positioned relative to the resistor to define a desired resistor value. A thick-film resistor may include one or more resistor segments configured to be selectively open-circuited to incrementally adjust the value of the resistor.
Public/Granted literature
- US20050035845A1 Fabrication of thick film electrical components Public/Granted day:2005-02-17
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