Invention Grant
- Patent Title: High density patching system with longframe jacks
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Application No.: US10894866Application Date: 2004-07-20
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Publication No.: US07044803B2Publication Date: 2006-05-16
- Inventor: Scott K. Baker , Bruce R. Musolf , James Dewey , Jeffrey L. Peters , Thomas Good
- Applicant: Scott K. Baker , Bruce R. Musolf , James Dewey , Jeffrey L. Peters , Thomas Good
- Applicant Address: US MN Eden Prairie
- Assignee: ADC Telecommunications, Inc.
- Current Assignee: ADC Telecommunications, Inc.
- Current Assignee Address: US MN Eden Prairie
- Agency: Merchant & Gould P.C.
- Main IPC: H01R24/04
- IPC: H01R24/04

Abstract:
A patching system is disclosed herein. The patching system includes a plurality of front-loaded patching modules positionable within a chassis. Each of the patching modules includes first and second longframe jack assemblies and a switch for changing the circuit configurations of the patching module. The patching modules and the chassis provide increased patching density.
Public/Granted literature
- US20060019548A1 High density patching system with longframe jacks Public/Granted day:2006-01-26
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