- 专利标题： Use of polybenzoxazoles (PBOS) for adhesion
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申请号： US10208397申请日： 2002-07-30
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公开(公告)号： US07052936B2公开(公告)日： 2006-05-30
- 发明人: Andreas Walter , Recai Sezi
- 申请人： Andreas Walter , Recai Sezi
- 申请人地址： DE Munich
- 专利权人： Infineon Technologies AG
- 当前专利权人： Infineon Technologies AG
- 当前专利权人地址： DE Munich
- 代理机构： Jenkins, Wilson & Taylor, P.A.
- 优先权： DE10137375 20010731
- 主分类号： H01L21/44
- IPC分类号： H01L21/44 ; H01L21/48 ; H01L21/50
摘要：
The present invention describes the use of polybenzoxazoles (PBOs) for adhesively bonding articles or materials, especially components used in the semiconductor industry, such as chips and wafers, a process for adhesively bonding materials, especially chips and wafers, chip and/or wafer stacks produced by the process, and adhesive compositions which comprise the polybenzoxazoles of the formula (I).
公开/授权文献
- US20030149207A1 Use of polybenzoxazoles (PBOS) for adhesion 公开/授权日：2003-08-07
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