Invention Grant
- Patent Title: Apparatus for connecting an IC terminal to a reference potential
- Patent Title (中): 用于将IC端子连接到参考电位的装置
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Application No.: US10911381Application Date: 2004-08-04
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Publication No.: US07057271B2Publication Date: 2006-06-06
- Inventor: Johann-Peter Forstner , Stephan Weber
- Applicant: Johann-Peter Forstner , Stephan Weber
- Applicant Address: DE Munich
- Assignee: Infineon Technologies AG
- Current Assignee: Infineon Technologies AG
- Current Assignee Address: DE Munich
- Agency: Maginot, Moore & Beck
- Priority: DE10204403 20020204
- Main IPC: H01L23/52
- IPC: H01L23/52 ; H01L23/48
Abstract:
A circuit chip has an apparatus for an electrically conductive connection of a terminal thereof to an external reference potential. The apparatus has a parallel connection of a bonding wire and a semiconductor area formed in a substrate of the circuit chip. The semiconductor area is doped higher than the substrate of the circuit chip.
Public/Granted literature
- US20050067697A1 Apparatus for connecting an IC terminal to a reference potential Public/Granted day:2005-03-31
Information query
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