- 专利标题: Sockets for “springed” semiconductor devices
-
申请号: US10673691申请日: 2003-09-29
-
公开(公告)号: US07059047B2公开(公告)日: 2006-06-13
- 发明人: Thomas H. Dozier, II , Benjamin N. Eldridge , Gary W. Grube , Igor Y. Khandros , Gaetan L. Mathieu , David V. Pedersen , Michael A. Stadt
- 申请人: Thomas H. Dozier, II , Benjamin N. Eldridge , Gary W. Grube , Igor Y. Khandros , Gaetan L. Mathieu , David V. Pedersen , Michael A. Stadt
- 申请人地址: US CA Livermore
- 专利权人: FormFactor, Inc.
- 当前专利权人: FormFactor, Inc.
- 当前专利权人地址: US CA Livermore
- 代理商 N. Kenneth Burraston
- 主分类号: H01R9/00
- IPC分类号: H01R9/00
摘要:
Temporary connections to spring contact elements extending from an electronic component such as a semiconductor device are made by urging the electronic component, consequently the ends of the spring contact elements, vertically against terminals of an interconnection substrate, or by horizontally urging terminals of an interconnection substrate against end portions of the spring contact elements. A variety of terminal configurations are disclosed.
公开/授权文献
- US20040064941A1 Sockets for "springed" semiconductor device 公开/授权日:2004-04-08