发明授权
- 专利标题: Electrical connection structure for conductor formed on glass surface
- 专利标题(中): 玻璃表面形成的导体的电气连接结构
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申请号: US11138425申请日: 2005-05-27
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公开(公告)号: US07059884B2公开(公告)日: 2006-06-13
- 发明人: Katsumi Hisaeda , Shoichi Takeuchi
- 申请人: Katsumi Hisaeda , Shoichi Takeuchi
- 申请人地址: JP Tokyo
- 专利权人: Asahi Glass Company, Limited
- 当前专利权人: Asahi Glass Company, Limited
- 当前专利权人地址: JP Tokyo
- 代理机构: Oblon, Spivak, McClelland, Maier & Neustadt, P.C.
- 优先权: JP2002-345747 20021128
- 主分类号: H01R13/62
- IPC分类号: H01R13/62
摘要:
A conductor formed on a glass surface and a lead wire are electrically connected by a structure constituted by a small number of parts, which requires no soldering and achieves space-saving and low cost.An electrical connection structure for a conductor formed on a glass surface, comprising a conductor 2 formed on a glass surface, a cover member 5 made of an electrically insulating material forming a cavity 17 between the cover member 5 and the glass surface and having an insertion slot 11 communicating with the cavity 17, and a connection member 3 made of an electrically conductive material having elasticity and inserted into the insertion slot 11, wherein the connection member 3 and the conductor 2 are pressed to each other by the elasticity of the connection member 3 whereby they are electrically connected.
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