Invention Grant
- Patent Title: Electronic apparatus and shielding module thereof
- Patent Title (中): 电子设备及其屏蔽模块
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Application No.: US10945968Application Date: 2004-09-22
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Publication No.: US07061773B2Publication Date: 2006-06-13
- Inventor: Yi-Jen Chen
- Applicant: Yi-Jen Chen
- Applicant Address: TW Taipei
- Assignee: ASUSTeK Computer Inc.
- Current Assignee: ASUSTeK Computer Inc.
- Current Assignee Address: TW Taipei
- Agency: Birch Stewart Kolasch & Birch LLP
- Priority: TW92137510A 20031230
- Main IPC: H05K9/00
- IPC: H05K9/00

Abstract:
A shielding module is used for shielding an electrical device. In this case, the shielding module includes a heat-dissipating component, a casing and a connection component. The heat-dissipating component has a contacting portion to contact with the electrical device. The electrical device is located in the casing, which has an opening. The heat-dissipating component is disposed in the opening. The connection component and the casing fasten the heat-dissipating component on the electrical device. Furthermore, an electrical apparatus is provided and includes an electrical device, a heat-dissipating component, a casing, and a connection component. In this case, the electrical device is fastened on a circuit board. The heat-dissipating component has a contacting portion adjacent to the electrical device. The electrical device is disposed in the casing, which has an opening. The heat-dissipating component is disposed in the opening. The connection component and the casing fasten the heat-dissipating component on the electrical device.
Public/Granted literature
- US20050141211A1 Electronic apparatus and shielding module thereof Public/Granted day:2005-06-30
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