- 专利标题： Enhanced design and process for a conductive adhesive
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申请号： US10357950申请日： 2003-02-04
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公开(公告)号： US07063756B2公开(公告)日： 2006-06-20
- 发明人: Donald Seton Farquhar , Gerald Paul Kohut , Andrew Michael Seman , Michael Joseph Klodowski
- 申请人： Donald Seton Farquhar , Gerald Paul Kohut , Andrew Michael Seman , Michael Joseph Klodowski
- 申请人地址： US NY Armonk
- 专利权人： International Business Machines Corporation
- 当前专利权人： International Business Machines Corporation
- 当前专利权人地址： US NY Armonk
- 代理商 A. J. Samodovitz; William N. Hogg
- 主分类号： B32B37/04
- IPC分类号： B32B37/04 ; H05K1/02 ; H01L21/50 ; H01L23/00
摘要：
The present invention provides a new device and method for enhancing the electrical properties of the thick metal backer/electrically conductive thermoset adhesive/printed circuit board or card assembly. The enhanced electrical properties are obtained by providing a thin bondline of conductive adhesive that is essentially void free.
公开/授权文献
- US20030140488A1 Enhanced design and process for a conductive adhesive 公开/授权日：2003-07-31
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