Invention Grant
US07064432B2 Method and system for bonding a semiconductor chip onto a carrier using micro-pins 失效
使用微针将半导体芯片接合到载体上的方法和系统

Method and system for bonding a semiconductor chip onto a carrier using micro-pins
Abstract:
An anisotropically conductive layer “ACL” (50) for mechanical and electrical bonding of two circuit containing structures, such as a flip chip and carrier is disclosed. The ACL is formed of a rigid insulating substrate (72) or membrane (61) with a top and bottom planar surfaces formed with a plurality of pins therein. The pins extend beyond the top and bottom surfaces so that a portion of each pin is exposed. The pins provide electrical connection between contact terminals or pads of the flip chip and carrier and additionally provide mechanical support between the flip chip and carrier so that the flip chip can under go post-bonding processing without substantial deformation or breaking. A method of electrically and mechanically bonding the flip chip and carrier and a method of making a semiconductor device using the ACL is also disclosed.
Information query
Patent Agency Ranking
0/0