Invention Grant
US07064432B2 Method and system for bonding a semiconductor chip onto a carrier using micro-pins
失效
使用微针将半导体芯片接合到载体上的方法和系统
- Patent Title: Method and system for bonding a semiconductor chip onto a carrier using micro-pins
- Patent Title (中): 使用微针将半导体芯片接合到载体上的方法和系统
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Application No.: US10333199Application Date: 2001-07-26
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Publication No.: US07064432B2Publication Date: 2006-06-20
- Inventor: Sangmin Lee , Michael Gurvitch , Serge Luryi
- Applicant: Sangmin Lee , Michael Gurvitch , Serge Luryi
- Applicant Address: US NY Stony Brook
- Assignee: The Research Foundation of State University of New York
- Current Assignee: The Research Foundation of State University of New York
- Current Assignee Address: US NY Stony Brook
- Agency: Baker Botts L.L.P.
- International Application: PCT/US01/23572 WO 20010726
- International Announcement: WO02/09194 WO 20020131
- Main IPC: H01L23/48
- IPC: H01L23/48

Abstract:
An anisotropically conductive layer “ACL” (50) for mechanical and electrical bonding of two circuit containing structures, such as a flip chip and carrier is disclosed. The ACL is formed of a rigid insulating substrate (72) or membrane (61) with a top and bottom planar surfaces formed with a plurality of pins therein. The pins extend beyond the top and bottom surfaces so that a portion of each pin is exposed. The pins provide electrical connection between contact terminals or pads of the flip chip and carrier and additionally provide mechanical support between the flip chip and carrier so that the flip chip can under go post-bonding processing without substantial deformation or breaking. A method of electrically and mechanically bonding the flip chip and carrier and a method of making a semiconductor device using the ACL is also disclosed.
Public/Granted literature
- US20040038496A1 Method and system for bonding a semiconductor chip onto a carrier using micro-pins Public/Granted day:2004-02-26
Information query
IPC分类: