A wasteless type lamination system comprises a first transfer device for transferring along a first transfer path a continuous laminate film; a cutter for cutting the continuous laminate film in a predetermined length, provided beside the first transfer path at the downstream of the first transfer device; a second transfer device for transferring along the first transfer path a cut laminate film; a film detection sensor for detecting a leading edge of the continuous laminate film, provided beside the first transfer path at the downstream of the cutter; a card transfer device for transferring a card along a second transfer path; and a thermocompression bonding device for laminating the cut laminate film to the card. The continuous laminate film is moved backward from the cutter by a predetermined distance by the first transfer device before or after cutting action of the cutter.