In the surface acoustic wave device including a lead frame made of metal in which a plurality of inner leads 9 are formed, wherein a chip 1 comprising at least one piezoelectric substrate is mounted on a resin base 3 into which a lead frame is molded integrally, are provided a wire lead section metal surface 7a that is formed by exposing a wire lead section 7, which is electrically connected with an electrode of the chip through a bonding wire 4, out of inner leads that are arranged on both sides of the chip, from the resin base, and a chip lead section metal surface 10a that is formed by exposing a chip lead section 10, which is partially covered with the chip, from the resin base.