Invention Grant
- Patent Title: Methods for securing components of semiconductor device assemblies to each other with hybrid adhesive materials
- Patent Title (中): 用混合粘合剂材料将半导体器件组件的组件彼此固定的方法
-
Application No.: US10933889Application Date: 2004-09-02
-
Publication No.: US07071078B2Publication Date: 2006-07-04
- Inventor: W. Jeff Reeder , Tongbi Jiang
- Applicant: W. Jeff Reeder , Tongbi Jiang
- Applicant Address: US ID Boise
- Assignee: Micron Technology, Inc.
- Current Assignee: Micron Technology, Inc.
- Current Assignee Address: US ID Boise
- Agency: TraskBritt
- Main IPC: H01L21/30
- IPC: H01L21/30 ; H01L21/46
Abstract:
A method for securing two or more semiconductor device components to one another is provided. A hybrid adhesive material, including a pressure-sensitive component and a curable component, is used to at least temporarily secure the semiconductor device components to each other. The pressure-sensitive component of the hybrid adhesive material temporarily secures the semiconductor device components to one another. When the semiconductor device components are properly aligned, the curable component of the hybrid adhesive material may be cured to more permanently secure the semiconductor device components to one another. For example, when a thermoset material is used as the curable component, it may be cured by heating, such as at a temperature of lower than about 200° C. and as low as about 120° C. or less.
Public/Granted literature
Information query
IPC分类:
