发明授权
- 专利标题： Process for producing microelectromechanical components and a housed microelectromechanical component
- 专利标题（中）： 用于生产微电子机械部件和容纳的微机电部件的方法
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申请号： US10994659申请日： 2004-11-22
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公开(公告)号： US07071521B2公开(公告)日： 2006-07-04
- 发明人: Jürgen Leib , Florian Bieck
- 申请人： Jürgen Leib , Florian Bieck
- 申请人地址： DE Mainz
- 专利权人： Schott AG
- 当前专利权人： Schott AG
- 当前专利权人地址： DE Mainz
- 优先权： DE10141558 20010824; DE10141571 20010824; DE10222959 20020523
- 主分类号： H01L27/14
- IPC分类号： H01L27/14 ; H01L21/00 ; H01L21/302
摘要：
A process produces microelectromechanical components from a substrate that has a first side and a second side which is substantially opposite from the first side, and at least the first side has at least one microelectromechanical element. The process includes the step of providing at least one conductive passage into the substrate, connecting the first side to the second side, and securing at least one support to the first side of the substrate, with the at least one electrically conductive passage uncovered by thinning the substrate material with the mechanical stability being ensured by the support.
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