- 专利标题： Modular semiconductor workpiece processing tool
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申请号： US10157762申请日： 2002-05-28
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公开(公告)号： US07074246B2公开(公告)日： 2006-07-11
- 发明人: Robert W. Berner , Daniel J. Woodruff , Wayne J. Schmidt , Kevin W. Coyle , Vladimir Zila , Worm Lund
- 申请人： Robert W. Berner , Daniel J. Woodruff , Wayne J. Schmidt , Kevin W. Coyle , Vladimir Zila , Worm Lund
- 申请人地址： US MT Kalispell
- 专利权人： Semitool, Inc.
- 当前专利权人： Semitool, Inc.
- 当前专利权人地址： US MT Kalispell
- 代理机构： Perkins Coie LLP
- 主分类号： H01L21/00
- IPC分类号： H01L21/00 ; H01L21/64
摘要：
The present invention provides for a semiconductor workpiece processing tool and methods for handling semiconductor workpiece therein. The semiconductor workpiece processing tool preferably includes an interface section comprising at least one interface module and a processing section comprising a plurality of processing modules for processing the semiconductor workpieces. The semiconductor workpiece processing tool may have a conveyor for transferring the semiconductor workpieces between the interface modules and the processing modules.
公开/授权文献
- US20020194716A1 Modular semiconductor workpiece processing tool 公开/授权日：2002-12-26
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