- 专利标题： Adhesives for semiconductor applications efficient processes for producing such devices and the devices per se produced by the efficient processes
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申请号： US09954262申请日： 2001-09-17
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公开(公告)号： US07074481B2公开(公告)日： 2006-07-11
- 发明人: Michael John Watson
- 申请人： Michael John Watson
- 申请人地址： US MI Midland
- 专利权人： Dow Corning Corporation
- 当前专利权人： Dow Corning Corporation
- 当前专利权人地址： US MI Midland
- 代理机构： McKellar IP Law, PLLC
- 代理商 Robert L. McKellar
- 主分类号： B32B5/16
- IPC分类号： B32B5/16
摘要：
Die attach adhesives and methods for their use, along with the devices that are obtained by the use of the methods. Using semiconductor chips as an example, the adhesives and the method for using them provides an interface between a chip (die) and the chip support. The method includes creating a space between the chip and the chip support of a given sized opening.