- 专利标题： Miniature optical element for wireless bonding in an electronic instrument
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申请号： US10759266申请日： 2004-01-20
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公开(公告)号： US07074632B2公开(公告)日： 2006-07-11
- 发明人: Kenji Wada
- 申请人： Kenji Wada
- 申请人地址： JP Tokyo
- 专利权人： Seiko Epson Corporation
- 当前专利权人： Seiko Epson Corporation
- 当前专利权人地址： JP Tokyo
- 代理机构： Oliff & Berridge, PLC
- 优先权： JP2000-209352 20000711; JP2001-165017 20010531
- 主分类号： H01L21/00
- IPC分类号： H01L21/00
摘要：
A method of manufacturing an optical element including the steps of: forming a through hole in a semiconductor element which has an optical section and an electrode electrically connected to the optical section; and forming a conductive layer extending from a first surface of the semiconductor element on which the optical section is formed, through an inner wall surface of the through hole, to a second surface opposite to the first surface.
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