发明授权
- 专利标题： Semiconductor circuit module and method for fabricating semiconductor circuit modules
- 专利标题（中）： 半导体电路模块及半导体电路模块的制造方法
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申请号： US10630632申请日： 2003-07-29
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公开(公告)号： US07074696B1公开(公告)日： 2006-07-11
- 发明人: Gerd Frankowsky , Harry Hedler , Barbara Vasquez
- 申请人： Gerd Frankowsky , Harry Hedler , Barbara Vasquez
- 申请人地址： DE Munich
- 专利权人： Infineon Technologies AG
- 当前专利权人： Infineon Technologies AG
- 当前专利权人地址： DE Munich
- 代理机构： Fish & Richardson P.C.
- 优先权： DE10234951 20020731
- 主分类号： H01L21/00
- IPC分类号： H01L21/00 ; H01L21/44 ; H01L21/46
摘要：
The present invention provides a method for fabricating semiconductor circuit modules having the following steps: application of a patterned connection layer to a transfer substrate, application of active circuit devices and/or passive circuit devices with contact areas pointing toward the patterned connection layer, connection of the circuit devices to one another by means of a filler at least between the circuit devices, removal of the transfer substrate, and application of electrical connection devices for selective contact connection of the contact area of the circuit devices to one another.
信息查询
IPC分类:
