- 专利标题： Composition for polishing pad and polishing pad using the same
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申请号： US10868353申请日： 2004-06-16
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公开(公告)号： US07077879B2公开(公告)日： 2006-07-18
- 发明人: Toshihiro Ogawa , Kou Hasegawa , Nobuo Kawahashi
- 申请人： Toshihiro Ogawa , Kou Hasegawa , Nobuo Kawahashi
- 申请人地址： JP Tokyo
- 专利权人： JSR Corporation
- 当前专利权人： JSR Corporation
- 当前专利权人地址： JP Tokyo
- 代理机构： Oblon, Spivak, McClelland, Maier & Neustadt, P.C.
- 优先权： JP2000-161520 20000531
- 主分类号： B24D11/00
- IPC分类号： B24D11/00
摘要：
An object of the invention is to provide a polishing pad having the excellent slurry retaining properties and the large removal rate and a composition for a polishing pad which can form such the polishing pad. A composition for polishing pad of the invention is comprising a water-insoluble matrix material containing a crosslinked polymer and a water-soluble particle dispersed in the water-insoluble matrix material. The elongation remaining after breaking is 100% or less when a test piece comprising the water-insoluble matrix material is broken at 80° C. according to JIS K 6251. A polishing pad of the invention is that at least a part of the polishing pad comprises the composition for polishing pad.