发明授权
- 专利标题: Surface emitting semiconductor laser, and method and apparatus for fabricating the same
- 专利标题(中): 表面发射半导体激光器及其制造方法和装置
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申请号: US10384607申请日: 2003-03-11
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公开(公告)号: US07078257B2公开(公告)日: 2006-07-18
- 发明人: Akira Sakamoto , Hideo Nakayama , Yasuaki Miyamoto , Jun Sakurai
- 申请人: Akira Sakamoto , Hideo Nakayama , Yasuaki Miyamoto , Jun Sakurai
- 申请人地址: JP Tokyo
- 专利权人: Fuji Xerox Co., Ltd
- 当前专利权人: Fuji Xerox Co., Ltd
- 当前专利权人地址: JP Tokyo
- 代理机构: Oliff & Berridge, PLC
- 优先权: JP2002-256525 20020902
- 主分类号: H01L21/00
- IPC分类号: H01L21/00
摘要:
A method of fabricating a surface emitting semiconductor laser includes a first step of forming, on a substrate, multiple monitor-use semiconductor layers having stripes radiating from a center of the substrate, and a laser portion that includes semiconductor layers and is located on the periphery of the multiple monitor-use semiconductor layers, a second step of monitoring oxidized conditions on the multiple monitor-use semiconductor layers when a selectively oxidized region is formed in the laser portion, and a third step of controlling oxidization of the selectively oxidized region on the basis of the oxidized conditions thus monitored.
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