Invention Grant
- Patent Title: Flip-chip automatically aligned optical device
- Patent Title (中): 倒装芯片自动对准光学设备
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Application No.: US10374798Application Date: 2003-02-25
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Publication No.: US07079559B2Publication Date: 2006-07-18
- Inventor: Tansen Varghese , William Ring
- Applicant: Tansen Varghese , William Ring
- Applicant Address: US PA Middletown
- Assignee: Tyco Electronics Corporation
- Current Assignee: Tyco Electronics Corporation
- Current Assignee Address: US PA Middletown
- Main IPC: H01S5/00
- IPC: H01S5/00
Abstract:
A semiconductor laser device with a first side and a second side, comprising (a) an active region, (b) a P layer, wherein the P layer contains a first contact area, (c) an N layer, wherein said N layer contains a second contact area, wherein the contact area of the first contact area of the P layer and the second contact layer of the N layer reside on the first side of the laser device.
Public/Granted literature
- US20040165634A1 Flip-chip automatically aligned optical device Public/Granted day:2004-08-26
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