发明授权
- 专利标题: Organic semiconductor element having high insulation strength and fabrication method thereof
- 专利标题(中): 绝缘强度高的有机半导体元件及其制造方法
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申请号: US10765220申请日: 2004-01-28
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公开(公告)号: US07081640B2公开(公告)日: 2006-07-25
- 发明人: Yoshihiko Uchida , Kenji Nakamura
- 申请人: Yoshihiko Uchida , Kenji Nakamura
- 申请人地址: JP Tokyo
- 专利权人: Pioneer Corporation
- 当前专利权人: Pioneer Corporation
- 当前专利权人地址: JP Tokyo
- 代理机构: Sughrue Mion, PLLC
- 优先权: JP2003-019995 20030129
- 主分类号: H01L35/24
- IPC分类号: H01L35/24
摘要:
The present invention provides an organic semiconductor element in which the insulation strength of the insulation layer and the carrier mobility of the organic semiconductor are both high. The semiconductor layer is an organic semiconductor element consisting of an organic compound. A gate oxide film consisting of an oxide of the gate electrode material is provided between the gate electrode and the gate insulation layer. The gate insulation layer consists of an organic compound.
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