发明授权
- 专利标题： Method of producing a heat dissipation substrate of molybdenum powder impregnated with copper with rolling in primary and secondary directions
- 专利标题（中）： 在一次方向和二次方向上轧制铜的钼粉末的散热基板的制造方法
-
申请号： US10009822申请日： 2001-04-12
-
公开(公告)号： US07083759B2公开(公告)日： 2006-08-01
- 发明人: Mitsuo Osada , Norio Hirayama , Tadashi Arikawa , Yoshinari Amano , Hidetoshi Maesato , Hidefumi Hayashi , Hiroshi Murai
- 申请人： Mitsuo Osada , Norio Hirayama , Tadashi Arikawa , Yoshinari Amano , Hidetoshi Maesato , Hidefumi Hayashi , Hiroshi Murai
- 申请人地址： JP Tokyo
- 专利权人： A.L.M.T. Corp.
- 当前专利权人： A.L.M.T. Corp.
- 当前专利权人地址： JP Tokyo
- 代理机构： Sughrue Mion, PLLC
- 优先权： JP2000/17584 20000126; JP2000/113006 20000414; JP2000/372405 20001207
- 国际申请： PCT/JP01/03164 WO 20010412
- 国际公布： WO01/80313 WO 20011025
- 主分类号： B22F3/02
- IPC分类号： B22F3/02 ; B22F3/26 ; B22F7/02 ; C21D1/00
摘要：
A material for a semiconductor-mounting heat dissipation substrate comprises a copper-molybdenum rolled composite obtained by impregnating melted copper into a void between powder particles of a molybdenum powder compact to obtain a composite of molybdenum and copper and then rolling the composite. In a final rolling direction of a plate material, the coefficient of linear expansion is 8.3×10−6/K at 30–800° C. The material for a semiconductor-mounting heat dissipation substrate is superior in thermal conductivity to a CMC clad material and easy in machining by a punch press. The substrate material is used as a heat dissipation substrate (13) of a ceramic package (11).
公开/授权文献
信息查询
