发明授权
- 专利标题: Curable liquid resin composition
- 专利标题(中): 可固化液体树脂组合物
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申请号: US10488472申请日: 2002-09-26
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公开(公告)号: US07084187B2公开(公告)日: 2006-08-01
- 发明人: Hideaki Takase , Yoshikazu Yamaguchi , Takayoshi Tanabe
- 申请人: Hideaki Takase , Yoshikazu Yamaguchi , Takayoshi Tanabe
- 申请人地址: NL Heerlen JP Tokyo JP Tokyo
- 专利权人: DSM IP Assets B.V.,JSR Corporation,Japan Fine Coatings Co., Ltd.
- 当前专利权人: DSM IP Assets B.V.,JSR Corporation,Japan Fine Coatings Co., Ltd.
- 当前专利权人地址: NL Heerlen JP Tokyo JP Tokyo
- 代理机构: Mayer, Brown, Rowe & Maw LLP
- 优先权: JP2001-296789 20010927
- 国际申请: PCT/NL02/00623 WO 20020926
- 国际公布: WO03/027191 WO 20030403
- 主分类号: C08J3/28
- IPC分类号: C08J3/28
摘要:
To provide a radiation-sensitive curable liquid resin composition having excellent applicability and capable of producing a film excelling in hardness, scratch resistance, adhesion, transparency, and appearance of the surface of the film.A curable liquid resin composition comprising: (A) particles prepared by bonding at least one oxide of an element selected from the group consisting of silicon, aluminum, zirconium, titanium, zinc, germanium, indium, tin, antimony, and cerium to a specific organic compound which comprises a polymerizable unsaturated group and a group shown by —X—C(═Y)—NH— (wherein X is NH, O, or S, and Y is O or S), and preferably a silanol group, (B) a compound having two or more polymerizable unsaturated groups in the molecule, (C) a specific alkylene glycol organic solvent, and preferably (D) a polymerization initiator.
公开/授权文献
- US20050070623A1 Curable liquid resin composition 公开/授权日:2005-03-31