Invention Grant
- Patent Title: Electrical device allowing for increased device densities
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Application No.: US10237645Application Date: 2002-09-09
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Publication No.: US07084351B2Publication Date: 2006-08-01
- Inventor: Salman Akram , Warren M. Farnworth , Alan G. Wood , J. Michael Brooks , Eugene H. Cloud
- Applicant: Salman Akram , Warren M. Farnworth , Alan G. Wood , J. Michael Brooks , Eugene H. Cloud
- Applicant Address: US ID Boise
- Assignee: Micron Technology, Inc.
- Current Assignee: Micron Technology, Inc.
- Current Assignee Address: US ID Boise
- Agency: Kirkpatrick & Lockhart Nicholson Graham LLP
- Main IPC: H05K1/18
- IPC: H05K1/18
Abstract:
A device comprising a circuit, a lead having a first end connected to the circuit and having a second end, and a deformable structure connected to the second end of the lead. The invention may be embodied on a circuit board, so that the circuit board includes a substrate and a deformable structure connected to said substrate.
Public/Granted literature
- US20030007340A1 Electrical device allowing for increased device densities Public/Granted day:2003-01-09
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