发明授权
- 专利标题: Microelectronic element having trench capacitors with different capacitance values
- 专利标题(中): 具有不同电容值的沟槽电容器的微电子元件
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申请号: US10710146申请日: 2004-06-22
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公开(公告)号: US07084449B2公开(公告)日: 2006-08-01
- 发明人: Kangguo Cheng , Johnathan E. Faltermeier , David R. Hanson , Carl J. Radens
- 申请人: Kangguo Cheng , Johnathan E. Faltermeier , David R. Hanson , Carl J. Radens
- 申请人地址: US NY Armonk
- 专利权人: International Business Machines Corporation
- 当前专利权人: International Business Machines Corporation
- 当前专利权人地址: US NY Armonk
- 代理商 Daryl K. Neff; H. Daniel Schnurmann
- 主分类号: H01L27/108
- IPC分类号: H01L27/108 ; H01L29/00
摘要:
A microelectronic element is provided having a major surface, the microelectronic element including a first capacitor formed on a sidewall of a first trench, the first trench being elongated in a downwardly extending direction from the major surface. The microelectronic element further includes a second capacitor formed on a sidewall of a second trench, the second trench being elongated in a downwardly extending direction from the major surface, wherein a top of the first capacitor is disposed at a first depth from the major surface, and a top of the second capacitor is disposed at a second depth from the major surface.
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