发明授权
US07084655B2 Burn-in test apparatus for BGA packages using forced heat exhaust
失效
使用强制排热的BGA封装的老化测试装置
- 专利标题: Burn-in test apparatus for BGA packages using forced heat exhaust
- 专利标题(中): 使用强制排热的BGA封装的老化测试装置
-
申请号: US11025092申请日: 2004-12-28
-
公开(公告)号: US07084655B2公开(公告)日: 2006-08-01
- 发明人: Byung-Jun Min , Woo-Jin Kim , Jeong-Ho Bang , Hyun-Seop Shim , Hyun-Geun Iy , Jae-Il Lee
- 申请人: Byung-Jun Min , Woo-Jin Kim , Jeong-Ho Bang , Hyun-Seop Shim , Hyun-Geun Iy , Jae-Il Lee
- 申请人地址: KR Suwon-si
- 专利权人: Samsung Electronics Co., Ltd.
- 当前专利权人: Samsung Electronics Co., Ltd.
- 当前专利权人地址: KR Suwon-si
- 代理机构: Marger Johnson & McCollom, P.C.
- 优先权: KR10-2004-0010375 20040217
- 主分类号: G01R31/02
- IPC分类号: G01R31/02
摘要:
A forced air heat exhaust type of burn-in test apparatus for packages: A first air supply duct provides air to the burn-in chamber and a second air supply duct provides air to supply tubes that direst air into the test sockets that hold the packages. The test sockets have a structure that allows air ventilation of the conductive balls. Accordingly, the apparatus can control the temperature around the packages as well as the temperature in the burn-in chamber, thus preventing conductive ball-melting.
公开/授权文献
信息查询