发明授权
- 专利标题: Fluid-ejection assembly
- 专利标题(中): 流体喷射组件
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申请号: US10693777申请日: 2003-10-25
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公开(公告)号: US07086716B2公开(公告)日: 2006-08-08
- 发明人: Steve Steinfield , Scott Hock , Myron A. Bezenek , Victor T. Escobedo , Kenneth J. Courian , Mohammad M. Samii , Juan C. Vives , Antoni Murcia , David Berardelli
- 申请人: Steve Steinfield , Scott Hock , Myron A. Bezenek , Victor T. Escobedo , Kenneth J. Courian , Mohammad M. Samii , Juan C. Vives , Antoni Murcia , David Berardelli
- 申请人地址: US TX Houston
- 专利权人: Hewlett-Packard Development Company, L.P.
- 当前专利权人: Hewlett-Packard Development Company, L.P.
- 当前专利权人地址: US TX Houston
- 主分类号: B41J2/165
- IPC分类号: B41J2/165
摘要:
A fluid-ejection assembly of one embodiment is disclosed comprising first and second arrays of fluid-ejection mechanisms, first and second service stations, and first and second drive mechanisms. The first array ejects fluid onto media; the first service station is to service the first array. The second array ejects fluid onto the media; the second service station is to service the second array. The first drive mechanism moves the first array between a first position to eject fluid onto the media and a second position at the first service station, while the second array ejects fluid onto the media in place of the first array. The second drive mechanism moves the second array between a third position to eject fluid onto the media and a fourth position at the second service station while the first array ejects fluid onto the media in place of the second array.
公开/授权文献
- US20050088479A1 Fluid-ejection assembly 公开/授权日:2005-04-28
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