发明授权
- 专利标题: Method for manufacture of multilayer ceramic substrate and multilayer ceramic substrate
- 专利标题(中): 多层陶瓷基板和多层陶瓷基板的制造方法
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申请号: US11082970申请日: 2005-03-18
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公开(公告)号: US07088568B2公开(公告)日: 2006-08-08
- 发明人: Hideki Yoshikawa , Hiroshi Nonoue , Kenichiro Wakisaka
- 申请人: Hideki Yoshikawa , Hiroshi Nonoue , Kenichiro Wakisaka
- 申请人地址: JP Osaka
- 专利权人: Sanyo Electric Co., Ltd.
- 当前专利权人: Sanyo Electric Co., Ltd.
- 当前专利权人地址: JP Osaka
- 代理机构: McDermott Will & Emery LLP
- 优先权: JP2004-103929 20040331
- 主分类号: H01G4/005
- IPC分类号: H01G4/005 ; H01G4/06 ; C03B29/00
摘要:
A method for manufacturing a multilayer ceramic substrate including the steps of providing multilayers of ceramic green sheets each having an electrode layer formed on a dielectric layer such that, after firing, at least one electrode layer which is separated by the dielectric layer from the adjacent electrode layer in the substrate has an overlapping area of 0.4 mm2 or smaller with the adjacent electrode; and firing the multilayers of the ceramic green sheets at a selected temperature such that, after firing, an interface between the dielectric layer and the electrode layer in the substrate has irregularities with a roughness Rmax of 6 μm or less per 100 μm standard length and the dielectric layer has a saturation sintered density.
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