发明授权
- 专利标题： Polishing solution and method of polishing nonferrous metal materials
- 专利标题（中）： 抛光溶液和抛光有色金属材料的方法
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申请号： US11015323申请日： 2004-12-20
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公开(公告)号： US07090564B2公开(公告)日： 2006-08-15
- 发明人: Youichiro Suzuki , Satoru Arita , Hirokazu Fukui , Kazuyo Tsuchiya
- 申请人： Youichiro Suzuki , Satoru Arita , Hirokazu Fukui , Kazuyo Tsuchiya
- 申请人地址： JP Osaka
- 专利权人： C. Uyemura & Co., Ltd.
- 当前专利权人： C. Uyemura & Co., Ltd.
- 当前专利权人地址： JP Osaka
- 代理机构： Oblon, Spivak, McClelland, Maier & Neustadt, P.C.
- 优先权： JP2003-424726 20031222
- 主分类号： B24B1/00
- IPC分类号： B24B1/00
摘要：
A polishing solution, comprising copper ions and chloride ions in Cu/Cl molar ratio of 10−1 to 103 and at pH 0.5 to 10, is suited for polishing a surface composed of a nonferrous metal material such as copper or copper alloy. Thicker metal film can be polished at high removal rate, so that distribution in film thickness becomes uniform.
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