Invention Grant
- Patent Title: Forming method and a forming apparatus of nanocrystalline silicon structure
- Patent Title (中): 纳米晶硅结构的成型方法和成型装置
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Application No.: US10927159Application Date: 2004-08-27
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Publication No.: US07091138B2Publication Date: 2006-08-15
- Inventor: Yoichiro Numasawa , Nobuyoshi Koshida
- Applicant: Yoichiro Numasawa , Nobuyoshi Koshida
- Applicant Address: JP Fuchu JP Koganei
- Assignee: Anelva Corporation,Nobuyoshi Koshida
- Current Assignee: Anelva Corporation,Nobuyoshi Koshida
- Current Assignee Address: JP Fuchu JP Koganei
- Agency: Buchanan Ingersoll PC
- Priority: JP2003-307592 20030829
- Main IPC: H01L21/31
- IPC: H01L21/31

Abstract:
A forming method and a forming apparatus of nanocrystalline silicon structure makes it possible to prepare a nanocrystalline silicon structure at a low temperature to have densely packed silicon crystal grains which are stably terminated and to effectively control the grain size in nanometer scale. A forming method and a forming apparatus of nanocrystalline silicon structure with oxide or nitride termination, carry out a first step of treating a surface of a substrate with hydrogen radical; a second step of depositing silicon crystals having a grain size of 10 nm or less by the thermal reaction of a silicon-containing gas; and a third step of terminating the surface of the silicon crystal with oxygen or nitrogen by using one of oxygen gas, oxygen radical and nitrogen radical.
Public/Granted literature
- US20050048796A1 Forming method and a forming apparatus of nanocrystalline silicon structure Public/Granted day:2005-03-03
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