- 专利标题: Semiconductor device
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申请号: US11043336申请日: 2005-01-27
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公开(公告)号: US07091518B2公开(公告)日: 2006-08-15
- 发明人: Tetsuya Yoshida , Yoshihiko Koike
- 申请人: Tetsuya Yoshida , Yoshihiko Koike
- 申请人地址: JP Kawasaki
- 专利权人: Fujitsu Limited
- 当前专利权人: Fujitsu Limited
- 当前专利权人地址: JP Kawasaki
- 代理机构: Arent Fox PLLC
- 优先权: JP2004-262392 20040909
- 主分类号: H01L23/58
- IPC分类号: H01L23/58
摘要:
A first wiring part in a first wiring layer is a starting terminal that is connected to a ground potential. The first wiring part and a second wiring part in a second wiring layer are connected by a first connecting part. The second wiring part and a third wiring part in a third wiring layer are connected by a second connecting part. A fourth wiring part continuously connected with the third wiring part and a fifth wiring part in the second wiring layer are connected by a third connecting part. The fifth wiring part and a sixth wiring part in the first wiring layer are connected by a fourth connecting part. A conducting path that is continuously connected from the starting terminal to an output end is formed by connecting a mound-shaped conducting path thus formed.
公开/授权文献
- US20060049400A1 Semiconductor device 公开/授权日:2006-03-09
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